Non-volatile memory devices with wraparound-shaped floating gate electrodes and methods of forming same

ABSTRACT

Non-volatile memory devices include memory cells therein with reduced cell-to-cell coupling capacitance. These memory cells include floating gate electrodes with open-ended wraparound shapes that operate to reduce the cell-to-cell coupling capacitance in a bit line direction, while still maintaining a high coupling ratio between control and floating gate electrodes within each memory cell.

REFERENCE TO PRIORITY APPLICATION

This application claims priority under 35 USC §119 to Korean Application Serial No. 2005-0100411, filed Oct. 24, 2005, the disclosure of which is hereby incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to integrated circuit memory devices and methods of forming same and, more particularly, to non-volatile memory devices and methods of forming non-volatile memory devices.

BACKGROUND OF THE INVENTION

One class of nonvolatile memory devices includes electrically erasable programmable read only memory (EEPROM), which may be used in many applications including embedded applications and mass storage applications. In typical embedded applications, an EEPROM device may be used to provide code storage in personal computers or mobile phones, for example, where fast random access read times may be required. Typical mass storage applications include memory card applications requiring high capacity and low cost.

One category of EEPROM devices includes NAND-type flash memories, which can provide a low cost and high capacity alternative to other forms of nonvolatile memory. A typical NAND-type flash memory includes a plurality of NAND-type strings therein that are disposed side-by-side in a semiconductor substrate. Each EEPROM cell within a NAND-type string includes a floating gate electrode and a control gate electrode, which is electrically connected to a respective word line. These EEPROM cells may be cells that support a single or a multi-level programmed state. EEPROM cells that support only a single programmed state are typically referred to as single level cells (SLC). In particular, an SLC may support an erased state, which may be treated as a logic 1 storage value, and a programmed state, which may be treated as a logic 0 storage value. The SLC may have a negative threshold voltage (Vth) when erased (e.g., −3V<Vth<−1V) and a positive threshold voltage when programmed (e.g., 1V<Vth<3V).

The state of an EEPROM cell may be detected by performing a read operation on a selected cell. As will be understood by those skilled in the art, a NAND string will operate to discharge a precharged bit line BL when a selected cell is in an erased state and a selected word line voltage (e.g., 0 Volts) is greater than the threshold voltage of the selected cell. However, when a selected cell is in a programmed state, the corresponding NAND string will provide an open circuit to the precharged bit line because the selected word line voltage (e.g., 0 Volts) is less than the threshold voltage of the selected cell and the selected cell remains “off”. Other aspects of NAND-type flash memories are disclosed in U.S. application Ser. No. 11/358,648, filed Feb. 21, 2006, and in an article by Jung et al., entitled “A 3.3 Volt Single Power Supply 16-Mb Nonvolatile Virtual DRAM Using a NAND Flash Memory Technology,” IEEE Journal of Solid-State Circuits, Vol. 32, No. 11, pp. 1748-1757, November (1997), the disclosures of which are hereby incorporated herein by reference.

Operations to program or erase an EEPROM cell may include the application of a relatively high program or erase voltage to the control electrode or channel region of the EEPROM cell, respectively. As will be understood by those skilled in the art, the magnitude of a program voltage should be sufficient to attract a sufficient number of electrons to a floating gate electrode within the cell and the magnitude of the erase voltage should be sufficient to withdraw a high percentage of accumulated electrons from the floating gate electrode. These operations to attract electrons to the floating gate electrode or withdraw electrons from the floating gate electrode result in a change in a threshold voltage of the EEPROM cell. In particular, operations to program an EEPROM cell may result in an increase in the threshold voltage of the EEPROM cell and operations to erase an EEPROM cell may result in a decrease in the threshold voltage of the EEPROM cell, as described above for both single and multi-level cells.

Unfortunately, as EEPROM devices become more highly integrated on a semiconductor substrate, the parasitic capacitance between floating gate electrodes of closely adjacent EEPROM cells may increase. As illustrated by FIGS. 1A-1C, this parasitic capacitance is directly proportional to the area of overlap between adjacent floating gate electrodes and inversely proportional to the lateral distance between adjacent floating gate electrodes. This lateral distance is typically reduced as the level of device integration increases. In particular, FIG. 1A illustrates an array of NAND-type EEPROM devices, which includes a plurality of floating gate electrodes 19 spaced side-by-side in two dimensions (e.g., row and column directions). These floating gate electrodes 19 are separated from active regions 13 of a semiconductor substrate 11 by tunnel insulating layers 17. These active regions 13 are defined by spaced-apart trench isolation regions 15. The control electrodes of each EEPROM cell within a row are commonly connected to respective word lines 23 (shown as word lines A, B and C). Each floating gate electrode 19 is separated from a corresponding word line by an inter-gate dielectric layer 21. As illustrated by FIGS. 1B-1C, the floating gate electrodes 19 are spaced apart from each other in a bit line direction by source/drain regions 25 and are spaced apart from each other in a word line direction by the trench isolation regions 15. The area of overlap between each floating gate electrode in the bit line direction is equivalent to the product h₁W₁ and the area of overlap between each floating gate electrode in the word line direction is equivalent to the product h₁×W₂.

These increases in parasitic capacitance caused by higher device integrated levels can result in a corresponding increase in floating gate interference. If this interference is sufficiently high, then the programming of one EEPROM cell may result in a threshold voltage shift of one or more closely adjacent EEPROM cells in the neighborhood of the EEPROM cell undergoing programming. Such shifts in threshold voltage can reduce memory device reliability by causing bit errors to occur during data reading operations. These and other consequences of increased parasitic capacitance between floating gate electrodes are described in an article by Jae-Duk Lee et al. entitled “Effects of Floating-Gate Interference on NAND Flash Memory Cell Operation,” IEEE Electron Device Letters, Vol. 23, No. 5, pp. 264-266, May (2002).

SUMMARY OF THE INVENTION

Embodiments of the invention include non-volatile memory devices having memory cells therein with reduced cell-to-cell coupling capacitance. According to some of these embodiments, non-volatile memory devices, such as NAND-type flash EEPROM devices, include memory cells with floating gate electrodes. These floating gate electrodes are formed to have an open-ended wraparound shape that operates to reduce parasitic cell-to-cell coupling capacitance in a bit line direction while maintaining a high coupling ratio between control and floating gate electrodes within each memory cell. In particular, each memory cell may include an EEPROM transistor therein. Each of these EEPROM transistors includes a tunneling insulating layer on a semiconductor channel region and a floating gate electrode on the tunneling insulating layer. The floating gate electrode has an open-ended wraparound shape that is filled with an electrically insulating region. According to some of these embodiments, the floating gate electrode may be shaped as a rectangular cylinder with a hollow center that is filled with the electrically insulating region.

According to still further embodiments of the invention, a non-volatile memory array includes a semiconductor substrate and at least one NAND-string of EEPROM cells in the semiconductor substrate. The at least one NAND-string of EEPROM cells includes a first non-volatile memory cell having a first open-ended and insulator-filled wraparound-shaped floating gate electrode therein and a second non-volatile memory cell having a second open-ended and insulator-filled wraparound-shaped floating gate electrode therein. The floating gate electrodes are configured so that a longitudinal axis of the first open-ended wraparound-shaped floating gate electrode is collinear with a longitudinal axis of the second open-ended wraparound-shaped floating gate electrode. The at least one NAND-string of EEPROM cells may also include a string selection transistor having a third open-ended insulator-filled wraparound-shaped gate electrode therein and a ground selection transistor having a fourth open-ended insulator-filled wraparound-shaped gate electrode therein. In these embodiments, a word line associated with the first non-volatile memory cell is separated from the first open-ended and insulator-filled wraparound-shaped floating gate electrode by a first inter-gate dielectric layer and a word line associated with the string selection transistor is electrically shorted to the third open-ended and insulator-filled wraparound-shaped floating gate electrode.

Still further embodiments of the invention include a method of forming a non-volatile memory array by forming a semiconductor substrate having first and second trench isolation regions therein that are spaced apart from each other by a semiconductor active region. A tunnel insulating layer is formed on the active region and then a first conductive layer is formed on sidewalls of the first and second trench isolation regions and on the tunnel insulating layer. An insulating region is formed on a portion of the first conductive layer extending opposite the tunnel insulating layer. A second conductive layer is then formed on the insulating region. The second conductive layer, the insulating region and the first conductive layer are then patterned in sequence to define an insulator-filled wraparound-shaped floating gate electrode.

According to further aspects of these embodiments, the patterning step may be preceded by the steps of forming an inter-gate dielectric layer on the second conductive layer and forming a third electrode layer on the inter-gate dielectric layer. The patterning step may also be preceded by a step of forming a contact hole that extends through the inter-gate dielectric layer and exposes the second conductive layer. In this case, the step of forming a third electrode layer may include depositing the third electrode layer into the contact hole. The patterning step may further include patterning the third conductive layer, the inter-gate dielectric layer, the second conductive layer, the insulating region and the first conductive layer in sequence to define a string selection line (SSL) including a first portion of the patterned third conductive layer and an underlying first portion of the patterned second conductive layer that is electrically connected to the first portion of the patterned third conductive layer at the location of the contact hole.

According to still further embodiments of the invention, the patterning step may be followed by the step of removing the patterned insulating region from the wraparound-shaped floating gate electrode. The removing step is followed by a step of depositing a dielectric layer onto the semiconductor substrate to thereby refill an interior of the wraparound-shaped floating gate with an electrically insulating material. This electrically insulating material may have a relatively low dielectric constant (e.g., lower dielectric constant relative to the patterned insulating region that is removed).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view of a conventional NAND-type EEPROM device.

FIG. 1B is a cross-sectional view of a portion of the NAND-type EEPROM device of FIG. 1A, taken along the word line direction I-I′ in FIG. 1A.

FIG. 1C is a cross-sectional view of a portion of the NAND-type EEPROM device of FIG. 1A, taken along the bit line direction II-II′ in FIG. 1A.

FIG. 2A is a plan layout view of a NAND-type EEPROM device according to embodiments of the present invention.

FIG. 2B is a cross-sectional view of the NAND-type EEPROM device of FIG. 2A, taken along the line B-B′ in FIG. 2A.

FIG. 2C is a cross-sectional view of the NAND-type EEPROM device of FIG. 2A, taken along the line C-C′ in FIG. 2A.

FIG. 2D is a cross-sectional view of the NAND-type EEPROM device of FIG. 2A, taken along the line D-D′ in FIG. 2A.

FIGS. 3A-3I and 4A-4I are cross-sectional views of intermediate structures that illustrate methods of forming EEPROM devices according to embodiments of the present invention.

FIGS. 5A-5E and 6A-6E are cross-sectional views of intermediate structures that illustrate methods of forming EEPROM devices according to embodiments of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention now will be described more fully herein with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout and signal lines and signals thereon may be referred to by the same reference characters.

A NAND-type EEPROM device according to first embodiments of the invention is illustrated by FIGS. 2A-2D. In particular, FIG. 2A, which is a plan layout view of a NAND-type EEPROM device, illustrates a plurality of bit lines 148 that extend in parallel in a first direction across a semiconductor substrate 100 having active regions 105 therein. As shown by FIG. 2B, these active regions 105 extend between adjacent trench isolation regions 106, which are located within shallow trenches 104. These bit lines 148 are connected vertically by bit line contact plugs 146 to corresponding ones of the active regions 105. These bit line contact plugs 146 are formed within contact openings 144. FIG. 2A also illustrates a plurality of word lines 132 a, a string select line 132 b, a ground select line 132 c and a common source line 140, which extend in parallel in a second direction across the semiconductor substrate 100. These first and second directions are illustrated as the bit line direction and the word line direction, respectively.

FIG. 2B illustrates a cross-sectional view of the NAND-type EEPROM device of FIG. 2A, taken along the bit line direction. As illustrated by FIG. 2B, each bit line 148 is electrically connected to a drain region 136 a of a corresponding string selection transistor (SST) within a corresponding NAND-type string of EEPROM cells. This electrical connection is provided by a bit line contact plug 146 (e.g., metal plug), which extends through a stacked arrangement of a first interlayer dielectric layer 138 and a second interlayer dielectric layer 142. The string selection transistor (SST) also includes a source/drain region 134, gate oxide layer 110 b, a lower string select gate electrode 120 b, an insulating region 115 b and an upper string select gate electrode 128 b, which is electrically connected to the lower string select gate electrode 120 b. The insulating region 115 b is formed on an upper surface 119 b of a lower portion of the lower string select gate electrode 120 b. The upper string select gate electrode 128 b is part of the string select line 132 b illustrated by FIG. 2A. The upper string select gate electrode 128 b is covered by an electrically insulating hard mask pattern 130 b. Region 122 b represents an inter-gate dielectric pattern having a contact opening 126 a therein and region 124 b is a lower conductive pattern. Regions 122 b and 124 b collectively form a buffer pattern 125 a.

A ground selection transistor (GST) includes a source region 136 b, which is electrically connected to the common source line 140, a source/drain region 134, gate oxide layer 110 c, a lower ground select gate electrode 120 c, an insulating region 115 c and an upper ground select gate electrode 128 c, which is electrically connected to the lower ground select gate electrode 120 c. The insulating region 115 c is formed on an upper surface 119 c of a lower portion of the lower ground select gate electrode 120 c. The upper ground select gate electrode 128 c is part of the ground select line 132 c illustrated by FIG. 2A. The upper ground select gate electrode 128 c is covered by an electrically insulating hard mask pattern 130 c. Region 122 c represents an inter-gate dielectric pattern having a contact opening 126 b therein and region 124 c is a lower conductive pattern. Regions 122 c and 124 c collectively form a buffer pattern 125 b.

FIG. 2B also illustrates a plurality of EEPROM cells within the NAND-type string associated with the corresponding bit line 148. These EEPROM cells extend in series between the ground selection transistor GST and the string selection transistor SST. Each EEPROM cell includes a pair of source/drain regions 134, a tunnel oxide layer 110 a and a floating gate electrode 120 a on the tunnel oxide layer 110 a. The tunnel oxide layer 110 a extends opposite a corresponding channel region within the substrate 100. Each channel region extends between a corresponding pair of source/drain regions within each EEPROM cell.

As described more fully hereinbelow, the floating gate electrode 120 a, which has an open-ended wraparound shape, is filled with an electrically insulating region 115 a. This electrically insulating region 115 a extends on an upper surface 119 a of a lower portion of the floating gate electrode 120 a. An inter-gate dielectric pattern 122 a is formed on the floating gate electrode 120 a, as illustrated. The control gate electrode 132 a, which represents a portion of a corresponding word line, comprises a composite of a lower conductive pattern 124 a and an upper conductive pattern 128 a. The upper conductive pattern 128 a is covered by an electrically insulating hard mask pattern 130 a.

A cross-sectional view of the NAND-type EEPROM device of FIG. 2A is illustrated by FIG. 2C. In particular, FIG. 2C illustrates a plurality of EEPROM cells that extend side-by-side in a word line direction (e.g., along line C-C′ in FIG. 2A). This word line direction is illustrated as being orthogonal to the direction of the bit lines 148, which extend on top of the second interlayer dielectric layer 142. Each of these EEPROM cells includes an open-ended wraparound-shaped floating gate electrode 120 a having a bottom electrode portion 171 a, a top electrode portion 173 a and side electrode portions 172 a. These electrode portions collectively define a floating gate electrode having the shape of a rectangular cylinder, which has a longitudinal axis extending in the bit line direction. This rectangular cylinder is filled with the insulating region 115 a.

As further illustrated by FIG. 2C, the source, drain and channel regions of each EEPROM cell are separate from the source, drain and channel regions of adjacent cells by corresponding isolation regions 106, which are located within shallow trenches 104. The tunnel oxide layer 110 a also extends between the upper sidewalls of the shallow trenches 104. The inter-gate dielectric pattern 122 a, the lower conductive pattern 124 a, the upper conductive pattern 128 a and the hard mask pattern 130 a are illustrated as being continuous in the word line direction.

A second cross-sectional view of the NAND-type EEPROM device of FIG. 2A is illustrated by FIG. 2D. In particular, FIG. 2D illustrates a plurality of string selection transistors (SST) that extend side-by-side in a word line direction (e.g., along line D-D′ in FIG. 2A). Each of these string selection transistors includes an open-ended wraparound-shaped lower string select gate electrode 120 b, an insulating region 115 b and an upper string select gate electrode 128 b (which represents a string selection word line). The lower string select gate electrode 120 b includes a bottom electrode portion 171 b, a top electrode portion 173 b and side electrode portions 172 b. These electrode portions collectively define a lower string select gate electrode having the shape of a rectangular cylinder. This rectangular cylinder is filled with the insulating region 115 b.

Methods of forming the NAND-type EEPROM device of FIGS. 2A-2D will now be described more fully with respect to FIGS. 3A-3I and 4A-4I. In particular, FIGS. 3A-3I are cross-sectional views of intermediate structures of an EEPROM device taken along a bit line direction and FIGS. 4A-4I are cross-sectional views of the same EEPROM device taken along a word line direction. FIG. 3I corresponds generally to the right half of FIG. 2B and FIG. 4I corresponds generally to the cross-section shown in FIG. 2C.

Referring now to FIGS. 3A and 4A, methods of forming a NAND-type EEPROM device according to embodiments of the invention include forming a hard mask pattern 102 on a primary surface of a semiconductor substrate 100. This hard mask pattern 102 may be formed by depositing a composite layer of silicon nitride and silicon oxide having a thickness in a range from about 300 Å to about 2000 Å on the semiconductor substrate 100 and then photolithographically patterning the deposited layer. Active regions 105 are then defined within the substrate 100 by selectively etching shallow trenches 104 into the substrate 100, using the hard mask pattern 102 as an etching mask. These trenches 104 are then filled with a trench isolation material (e.g., oxide). This filling of the trenches 104 may be performed by depositing an electrically insulating layer into the trenches 104 and then planarizing or otherwise etching back the deposited insulating layer to be planar with an upper surface of the hard mask pattern 102. This planarization step results in the definition of a plurality of trench isolation regions 106 within the substrate 100.

As illustrated by FIGS. 3B and 4B, the hard mask pattern 102 is then removed to expose recesses 108 within the trench isolation regions 106. Then, as shown by FIGS. 3C and 4C, a plurality of layers are formed on the substrate 100. These layers include a plurality of tunnel oxide layers 110, which may be formed by thermally oxidizing exposed portions of the active regions 105. These tunnel oxide layers 110 may have a thickness in a range from about 60 Å to about 100 Å. A first polysilicon layer 112 is then conformally deposited on the trench isolation regions 106 and the tunnel oxide layers 110, as illustrated. This first polysilicon layer 112 may be a doped or undoped layer having a thickness in a range from about 50 Å to about 200 Å. Next, a relatively thick electrically insulating layer 114 is conformally deposited on the first polysilicon layer 112. This electrically insulating layer 114 may have a thickness in a range from about 200 Å to about 1000 Å, which is sufficient to completely fill the recesses 108.

Referring now to FIGS. 3D and 4D, the electrically insulating layer 114 and the first polysilicon layer 112 are then planarized by an etch-back or chemical mechanical polishing (CMP) process. This planarization step is performed for a sufficient duration to expose upper surfaces of the trench isolation regions 106 and define a plurality of first polysilicon patterns 112 a. The planarized upper surface of the electrically insulating layer 114 is also further etched-back slightly to define a plurality of insulating regions 115 within the recesses 108. As illustrated, upper surfaces of these insulating regions 115 are recessed relative to the upper surfaces of the trench isolation regions 106.

Thereafter, as illustrated by FIGS. 3E and 4E, a second polysilicon layer 117 is conformally deposited on the structures of FIGS. 3D and 4D. In particular, the second polysilicon layer 117 is deposited on the trench isolation regions 106, the insulating regions 115 and the first polysilicon patterns 112 a. The second polysilicon layer 117 is then planarized to define a plurality of second polysilicon patterns 117 a, which have an upper surface that is planar with an upper surface of the trench isolation regions 106. As illustrated by FIGS. 3F and 4F, each of the second polysilicon patterns 117 a and a corresponding one of the first polysilicon patterns 112 a collectively form a corresponding preliminary floating gate electrode pattern 120. As shown by FIG. 3F, each preliminary floating gate electrode pattern 120 extends in a bit line direction for the full length of a NAND string (i.e., across multiple EEPROM cells).

Referring now to FIGS. 3G and 4G, a selective etch-back step is performed to recess the trench isolation regions 106 and fully expose sidewalls of first polysilicon patterns 112 a. Then, an inter-gate dielectric layer 122 and a lower conductive layer 124 (e.g., third polysilicon layer) are sequentially deposited onto the preliminary floating gate electrode patterns 120 and recessed trench isolation regions 106, as illustrated. The inter-gate dielectric layer 122 may be formed as an oxide-nitride-oxide (ONO) layer having a thickness in a range from about 100 Å to about 200 Å and the lower conductive layer 124 may be formed as a doped polysilicon layer having a thickness in a range from about 30 Å to about 200 Å.

A selective etching step is then performed to define a contact opening 126 a (and contact opening 126 b, not shown in FIG. 3G) that extends through the lower conductive layer 124 and the inter-gate dielectric layer 122 and exposes an upper surface of a corresponding preliminary floating gate electrode pattern 120. An upper conductive layer 128 (e.g., fourth polysilicon layer) and an electrically insulating hard mask layer 130 are then conformally deposited, as illustrated. The upper conductive layer 128 may be formed to have a thickness in a range from about 200 Å to about 1000 Å and the hard mask layer 130 may be formed as a silicon oxide layer having a thickness in a range from about 500 Å to about 2500 Å.

As illustrated by FIGS. 3H and 4H, a selective etching step(s) is performed to sequentially etch through the hard mask layer 130, the upper conductive layer 128, the lower conductive layer 124, the inter-gate dielectric layer 122, the preliminary floating gate electrode patterns 120 and the insulating regions 115, which fill the preliminary floating gate electrode patterns 120. These selective etching step(s) results in the definition of the hard mask patterns 130 a, 130 b (and 130 c shown in FIG. 2B), a plurality of word lines 132 a and floating gate electrodes 120 a of the EEPROM cells and a string select line 132 b, which connects the gate electrodes of the string select transistors (SST) within a corresponding row. The ground select line 132 c (not shown in FIG. 3H, but shown in FIG. 2B) is also defined. These selective etching step(s) also defines the electrically insulating regions 115 a within the floating gate electrodes 120 a and the insulating region 115 b associated with the string select transistor (SST). As described above with respect to FIG. 2D, each floating gate electrode 120 a has a bottom electrode portion 171 a, a top electrode portion 173 a and side electrode portions 172 a, as illustrated by FIG. 4H.

Referring now to FIGS. 2B, 3I and 4I, a selective ion-implanting/drive-in step is performed to define the source/drain regions of the EEPROM cells, string select transistors and ground select transistors. These source/drain regions are illustrated best by the reference numerals 134, 136 a and 136 b in FIG. 2B. After these regions have been formed, a first inter-layer dielectric layer 138 is formed on the substrate 100. This first inter-layer dielectric layer 138 may be silicon oxide layer having a thickness in a range from about 3000 Å to about 8000 Å. As illustrated by FIG. 2B, the first inter-layer dielectric layer 138 may be patterned to define a contact opening therein and a common source line 140 may be formed in the contact opening. This common source line 140 is electrically connected to the source region 136 b of each of the ground select transistors (GST) within a plurality of the NAND strings. A second inter-layer dielectric layer 142 is also formed on the first inter-layer dielectric layer 138 and on the common source line 140. This second inter-layer dielectric layer 142 may be silicon oxide layer having a thickness in a range from about 500 Å to about 2000 Å. A selective etching step is then performed to define a bit line contact opening 144 that extends through the fist and second inter-layer dielectric layers and exposes the drain region 136 a of the string selection transistor (SST). This bit line contact opening 144 is then filled with a bit line contact plug 146.

Additional methods of forming EEPROM devices according to embodiments of the invention are illustrated by FIGS. 5A-5E and 6A-6E. In particular, FIGS. 5A and 6A illustrate steps to form tunnel oxide patterns 110 and a polysilicon pattern 212 on the structures illustrated by FIGS. 3B and 4B. This polysilicon pattern 212 may be formed by depositing a blanket polysilicon layer and then planarizing the layer for a sufficient duration to expose upper surfaces of the trench isolation regions 106. Referring now to FIGS. 5B and 6B, this polysilicon pattern 212 is etched back to define a plurality of relatively thin polysilicon patterns 212 a on corresponding ones of the tunnel oxide patterns 110. Another polysilicon layer 214 is then conformally deposited on the tunnel oxide regions 106 and on the polysilicon patterns 212 a.

As illustrated by FIGS. 5C and 6C, the polysilicon layer 214 is selectively etched back to form polysilicon sidewall spacers 214 a on sidewalls of the openings 108 in the trench isolation regions 106. An electrically insulating layer is then deposited into the openings and onto the trench isolation regions and then planarized and etched-back to define a plurality of insulating regions 115 having upper surfaces that are recessed within corresponding ones of the openings 108. A polysilicon layer 216 is then conformally deposited onto the trench isolation regions 106 and onto the plurality of insulating regions 115. This polysilicon layer 216 is of sufficient thickness to completely fill the openings 108.

Referring now to FIGS. 5D and 6D, the polysilicon layer 216 is then planarized for a sufficient duration to expose the trench isolation regions 106 and thereby define a plurality of polysilicon patterns 216 a. This planarization step may include a chemical mechanical polishing and/or chemical etch-back process. This planarization of the polysilicon layer 216 results in the definition of a plurality of preliminary floating gate electrode structures 120′. Each of these preliminary floating gate electrode structures 120′ includes a corresponding polysilicon pattern 216 a, a pair of polysilicon sidewall spacers 214 a and a polysilicon pattern 212 a.

The structures of FIGS. 5D and 6D, which are similar to the structures of FIGS. 3F and 4F, undergo the further processing illustrated and described above with respect to FIGS. 3G-3H and 4G-4H. However, as illustrated by FIGS. 5E and 6E, the insulating regions 115 are removed by etching (e.g., wet etching) to thereby define a plurality of tunnel paths 121 a and 121 b associated with the EEPROM cells and string selection and ground selection transistors.

Thereafter, as illustrated by FIGS. 2B, 3I and 4I, a selective ion-implanting/drive-in step is performed to define the source/drain regions of a plurality of the EEPROM cells, string select transistors and ground select transistors (not shown in FIG. 4I). These source/drain regions are illustrated best by the reference numerals 134, 136 a and 136 b in FIG. 2B. After these regions have been formed, a first inter-layer dielectric layer 138 is formed on the substrate 100. This first inter-layer dielectric layer 138, which may be silicon oxide layer having a thickness in a range from about 2000 Å to about 8000 Å, is also provided to refill the tunnel paths 121 a and 121 b.

Then, as illustrated by FIG. 2B, the first inter-layer dielectric layer 138 may be patterned to define a contact opening therein and a common source line 140 may be formed in the contact opening. This common source line 140 is electrically connected to the source region 136 b of each of the ground select transistors (GST) within a plurality of the NAND strings. A second inter-layer dielectric layer 142 is also formed on the first inter-layer dielectric layer 138 and on the common source line 140. A selective etching step is then performed to define a bit line contact opening 144 that extends through the fist and second inter-layer dielectric layers and exposes the drain region 136 a of the string selection transistor (SST). This bit line contact opening 144 is then filled with a bit line contact plug 146.

In the drawings and specification, there have been disclosed typical preferred embodiments of the invention and, although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation, the scope of the invention being set forth in the following claims. 

1. A non-volatile memory cell, comprising: a semiconductor substrate having an active region therein that comprises source and drain regions of first conductivity type and a channel region extending between the source and drain regions; a tunnel insulating layer on the channel region; a control gate electrode on said semiconductor substrate; a floating gate electrode on said tunnel insulating layer, said floating gate electrode having an open-ended wraparound shape that is filled with an electrically insulating region, said open-ended wraparound shape being symmetrical about a longitudinal axis that extends in parallel across said semiconductor substrate in a drain-to-source direction so that open ends of said floating gate electrode have faces extending orthogonal to a surface of said semiconductor substrate on which said floating gate electrode extends; and an inter-gate dielectric layer extending between a portion of said floating gate electrode and said control gate electrode.
 2. The memory cell of claim 1, wherein said floating gate electrode has a rectangular cylinder shape.
 3. The memory cell of claim 1, wherein the electrically insulating region comprises CVD silicon oxide.
 4. A non-volatile memory cell, comprising: a semiconductor substrate having an active region therein that comprises source and drain regions of first conductivity type and a channel region extending between the source and drain regions; a tunnel insulating layer on the channel region; a cylinder-shaped floating gate electrode that extends on said tunnel insulating layer and is filled with an electrically insulating region, said cylinder-shaped floating gate electrode being symmetrical about a longitudinal axis that extends in parallel across said semiconductor substrate in a drain-to-source direction so that open ends of said cylinder-shaped floating gate have faces extending orthogonal to a surface of said semiconductor substrate on which said cylinder-shaped floating gate extends; a control gate electrode on said cylinder-shaped floating gate electrode; and an inter-gate dielectric layer extending between said cylinder-shaped floating gate electrode and said control gate electrode.
 5. The memory cell of claim 4, wherein the electrically insulating region comprises CVD silicon oxide. 